Premium solutions and services from DTS, FotoNation, HD Radio and
Invensas to be showcased by Xperi and its licensee partners
throughout the show
SAN JOSE, Calif.--(BUSINESS WIRE)--
Corporation (Nasdaq: XPER) ("Xperi") is proud to present its
latest audio, imaging and semiconductor bonding solutions from its
at CES 2018, January 9-12 in Las Vegas. The Xperi booth will be in the
Las Vegas Convention Center's North Hall, #5624, and company executives
are available by appointment to provide technology demos at the
Renaissance and Elara hotels.
"We are proud to highlight the latest updates and partner implementation
progress across all of our brands and technologies," said Jon Kirchner,
CEO, Xperi. "In 2018, Xperi will continue to innovate and expand its
reach through DTS, FotoNation, HD Radio and Invensas, and deliver on our
promise to enable extraordinary experiences for people around the world."
DTS continues to expand its commitment to the immersive audio experience
at home, with new partner products and services integrating DTS
Virtual:X™, DTS:X®, and DTS-HD®
technologies, as well as DTS® Play-Fi®
whole-home wireless audio technology. Demos of DTS audio solutions
for the home at the Renaissance are by appointment only. Partners
showcasing products with DTS solutions at CES include:
Amazon - The Phorus PS10 DTS Play-Fi smart speaker with
Amazon Alexa functionality.
Creative Labs - The X5 sound bar with DTS:X technology.
Denon - New A/V receivers with DTS:X and DTS Virtual:X
Emotiva - The RMC-1 A/V processor with DTS:X technology.
Hisense - The HS512 sound bar with DTS:X technology.
LG - Adopting the DTS-HD codec in its UHD and full
HD TVs in 2018, as well as introducing DTS Virtual:X technology into a
new sound bar, model SK6Y, and select televisions that will launch in
Europe, the Middle East and Asia in 2018.
Marantz - New A/V receivers with DTS:X and DTS Virtual:X
Nakamichi - The Shockwafe Ultra 9.2-channel sound bar system
and the Shockwafe Elite 7.2-channel sound bar feature DTS:X technology.
Onkyo - New 2018 A/V receivers including DTS:X and DTS Play-Fi
technology. (Note: DTS Play-Fi technology is in select new A/V
Pioneer and Pioneer Elite - New 2018 A/V
receivers with DTS:X technology and DTS Play-Fi. (Note: DTS Play-Fi
technology is in select new A/V receivers)
Sony - A new line-up of DTS:X-enabled A/V receivers for
2018, as well as the award-winning HT-ST5000 sound bar with DTS:X
Soundcast - The VG10, the world's first wireless outdoor
speaker enabled with DTS Play-Fi technology.
SVS - The Prime Wireless speaker system and the Prime Wireless
SoundBase with DTS Play-Fi technology.
Works with Amazon Alexa functionality for DTS Play-Fi
technology - The Pioneer Elite Smart Speaker F4, Onkyo Smart
Speaker P3 and the Phorus PS10 Smart Speaker now support Works with
Amazon Alexa functionality, allowing consumers to control their
wireless multi-room audio system from an Amazon Echo, Show or Dot.
Additional DTS Play-Fi-enabled products, including the Klipsch Stream
wireless multi-room audio lineup and products from Macintosh Labs,
MartinLogan and THIEL Audio, will add the capability by the end of Q1
MOBILE, PC, AR/VR AND GAMING
DTS continues to expand its footprint with key partners across its
offerings for gaming, AR/VR, PC and mobile products. New partnerships
and partner demos at CES include:
Osterhout Design Group (ODG) - Xperi's advanced sensory signal
processing, audio and imaging technologies, including DTS:X®
Ultra 1.0 audio technology and depth sensing technology from
FotoNation, enables an incredibly immersive experience on the new R-8
and R-9 Smartglasses from ODG. FotoNation's depth sensing technology
changes how users interact with their surroundings by delivering
impressive visual realism in AR environments. DTS:X Ultra 1.0
technology virtualizes sounds and accurately represents sound sources
in a 3D environment relative to the listener.
vTime - DTS has partnered with vTime, a virtual meeting and
collaboration space that works across all VR platforms available
today. vTime allows a group of up to four people to meet virtually in
simulated locations anywhere in the world. DTS® Custom
technology for VR and AR provides a fantastic 3D audio experience for
all vTime-supported devices, including Android (Samsung Gear VR
powered by Oculus, Google Daydream), PC (HTC Vive, Oculus Rift) and
Windows Mixed Reality.
Additionally, DTS is launching several new audio solutions, including:
DTS Headphone:X® 2.0 for Gaming Headphones -
The newest generation DTS Headphone:X 2.0 was designed with gamers
in mind. Building on market-tested, user-approved 3D virtualization
over headphones, DTS has made major improvements in the latest update,
such as introducing proximity cues and support for channel-based,
scene-based and object-based audio.
DTS® Audio Processing 1.0 for Mobile
Phones and Tablets - DTS Audio Processing 1.0 provides must-have
post-processing, including dialog enhancement, optimized bass response
and micro-speaker distortion prevention. DTS Audio Processing 1.0 also
includes up to three configurable content preset modes to provide an
amazing listening experience for any content type.
DTS:X® Premium 1.0 for Mobile Phones and
Tablets - For the best-sounding multi-channel audio for
media playback, the DTS:X Premium 1.0 solution provides amazing 3D
audio across multiple stereo modes and multi-channel support for up to
7.1 channels. It includes four configurable content presets and comes
with the DTS-HD® Master Audio decoder, providing
listeners access to a world of high quality content.
DTS:X® Ultra 1.0 for PC and Mobile -
This product represents DTS' best immersive audio experience for
games, VR and AR experiences. DTS:X Ultra supports 5.1 and 7.1
multi-channel audio, enables first-order ambisonics sound
extraordinary and provides support for audio objects. Additionally,
redesigned post-processing for speaker and headphone routes include
enhanced bass response, an ultra-realistic head tracker and headphone
tuning for up to six pre-loaded, featured headphones.
AUTOMOTIVE AND BROADCAST
HD Radio® technology delivers the high
quality digital broadcast of local AM/FM stations. Forty automotive
brands are currently shipping vehicles in North America equipped with HD
Radio technology, and more than 45 million HD Radio receivers are on the
road. More than 4,200 stations are broadcasting digital channels in
North America and include additional features that do not exist through
traditional analog broadcast, such as traffic and emergency alerts,
program info and Artist Experience®.
The DTS Connected Radio™ platform combines both over-the-air
analog/digital AM/FM radio content with IP-delivered content, creating
an innovative AM/FM experience in vehicles. DTS Connected Radio receives
metadata, such as artist and song title, directly from local radio
broadcasters, which is then paired with IP-delivered content, creating
an engaging in-vehicle hybrid radio experience. DTS Connected Radio is
planned to be commercially available in the second half of 2018.
HD Radio and DTS Connected Radio broadcast technologies will be
showcased at CES at Xperi's booth in the LVCC North Hall, #5624,
The latest HD Radio audio and data features will be on display from
Mercedes, Hyundai, Volvo, Honda, Fiat Chrysler and Subaru.
The latest home, portable and aftermarket products with HD Radio
solutions from leading manufacturers including Alpine, Pioneer,
Kenwood, Clarion, Sony, Outlaw, VQ, Sparc and Sangean.
A demonstration of what DTS Connected Radio looks like in New York,
Paris, London, Shanghai, Sydney and more locations, as well as how it
creates an engaging in-vehicle broadcast radio experience, globally.
Xperi will also feature FotoNation's Driver Monitoring System
(DMS) in its North Hall booth at CES. At the core of FotoNation DMS are
leading computer vision technologies that enable attentiveness
assessment, fatigue detection and driver drowsiness, as well as cabin
security and customization options based on driver identity. On display
will be the FotoNation DMS Core Library, fully operating off the Texas
Instruments TDA-3x ADAS platform from a single-camera. Demonstrated
feature sets include face detection, head positioning in 3D, eye
position in 2D and 3D, and eye opening levels, as well as biometrics
features including driver identification and authentication technologies.
For more than 20 years, FotoNation has been a global leader in computer
vision and computational photography solutions through its innovative
technologies that have been deployed in more than 3.3 billion devices
worldwide. Additionally, the company has maintained market leadership in
the fast-growing facial analytics segment. FotoNation will showcase its
latest technologies at CES in the North Hall, #5642 and the Renaissance
by appointment, including:
IrisXR™ - First in its class, highly secure (a false acceptance
rate of 1 in 10 million) and with state-of-the-art liveliness
detection to prevent spoofing, IrisXR is a product for the AR, VR and
3D Face Recognition - Tapping into the capabilities of
dual camera systems, 3DFR unleashes unprecedented accuracy in
Driver Identification - Seamless and accurate in-cabin
security and customization options, based on driver identity via iris
Electronic Image Stabilization - Software-hardware EIS
implementation that delivers the best video experience on the move by
correcting for six degrees of freedom and all distortion types.
Face Detection X - Driven by convolutional neural networks
(CNN) technology, Face Detection X is FotoNation's next-generation
face analytics technology.
Image Processing Unit - A fully programmable specialized
IP core that delivers more than 20 pre-integrated features. It is
highly customizable depending on the targeted market, be it mobile,
home or auto.
VR Portrait Enhancement - FotoNation's seventh-generation
face beautification suite brings together 19 dedicated features that
combine the best imaging technologies available for flawless portraits
in a spherical VR display space.
Invensas' DBI® and ZiBond®
semiconductor bonding solutions are foundational technologies for
next-generation electronics. These solutions currently enable the image
sensors in billions of smartphones and tablets around the world. DBI
technology is a low-temperature hybrid wafer bonding solution that
allows wafers to be bonded with scalable fine pitch 3D electrical
interconnect without requiring bond pressure. ZiBond is a
low-temperature homogenous direct bonding technology that forms strong
bonds between wafers or die with same or different coefficients of
thermal expansion (CTE).
At CES, Invensas will showcase its DBI technology in sensor enhancement
applications in automotive and mobile devices at the Xperi booth in the
North Hall, #5624. The latest Invensas news includes:
Successful transfer of DBI technology to SMIC, one of the
leading semiconductor foundries in the world, and Teledyne
DALSA, one of the world's foremost pure-play MEMS foundries, for
image sensor and MEMS devices for mobile, automotive, consumer
electronics and other markets.
Sony's back-side illuminated (BSI) image sensor
utilizes DBI technology and is integrated into many of the latest
premium smartphone models, including the Samsung Galaxy S8
and S8 Plus and Apple iPhone X, 8 and 8 Plus.
Invensas' bonding technology has been licensed by OmniVison.
ZiBond technology is used in the industry's first three-layer stacked
CMOS image sensor with DRAM for smartphones from Sony.
Invensas continues to work closely with MEMS suppliers for ZiBond and
DBI adoption in automotive and consumer applications that are expected
to be announced shortly.
For more information about Xperi and its subsidiaries, please visit www.xperi.com.
About Xperi Corporation
Xperi Corporation (Nasdaq: XPER) and its brands, DTS, FotoNation, HD
Radio, Invensas and Tessera, are dedicated to creating innovative
technology solutions that enable extraordinary experiences for people
around the world. Xperi's solutions are licensed by hundreds of leading
global partners and have shipped in billions of products in areas
including premium audio, automotive, broadcast, computational imaging,
computer vision, mobile computing and communications, memory, data
storage, and 3D semiconductor interconnect and packaging. For more
information, please call 408-321-6000 or visit www.xperi.com.
DTS, FotoNation, HD Radio, Invensas, Xperi and their respective logos
are trademarks or registered trademarks of affiliated companies of Xperi
Corporation in the United States and other countries. All other company,
brand and product names may be trademarks or registered trademarks of
their respective companies.
SOURCE: XPERI CORPORATION
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Source: Xperi Corporation
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