One of the world's largest independent MEMS foundries ready to
manufacture MEMS and image sensor products utilizing Invensas wafer
bonding and 3D interconnect technology
SAN JOSE, Calif.--(BUSINESS WIRE)--
Invensas, a wholly owned subsidiary of Xperi Corporation ("Xperi")
(NASDAQ:XPER), today announced the successful technology transfer of its
Direct Bond Interconnect (DBI®) to Teledyne DALSA, a Teledyne
Technologies company. This capability enables Teledyne DALSA to deliver
next-generation MEMS and image sensor solutions that are more compact
and higher performance to customers in the automotive, IoT and consumer
electronics markets. Teledyne DALSA is an international leader in high
performance digital imaging and semiconductors and one of the world's
foremost pure-play MEMS foundries. Invensas and Teledyne DALSA announced
the signing of a development license in February 2017.
"In partnership with Invensas, we have successfully completed the
transfer of its revolutionary DBI technology to our manufacturing
facilities in Bromont," said Edwin Roks, president of Teledyne DALSA.
"We are now ready to offer this enabling platform as part of our foundry
services to customers, including our own business lines, seeking
smaller, higher performance and more reliable MEMS and imaging
solutions."
"The manufacturing team at Teledyne DALSA has done a fantastic job
bringing up our DBI process and is well-positioned to enable a new
generation of high performance MEMS and image sensor solutions," said
Craig Mitchell, president of Invensas. "We are excited about the
prospects for DBI to be integrated into a wide range of Teledyne DALSA's
branded products as well as those of their foundry customers."
DBI technology is a low-temperature hybrid wafer bonding solution that
allows wafers to be bonded with scalable fine pitch 3D electrical
interconnect without requiring bond pressure. The technology is
applicable to a wide range of semiconductor devices including MEMS,
image sensors, RF front ends and stacked memory. DBI 3D interconnect can
eliminate the need for through-silicon vias (TSVs) and reduce die size
and cost while enabling pixel level interconnect for future generations
of image sensors.
For more information on DBI technology and other advanced semiconductor
packaging and interconnect solutions from Invensas, please visit www.invensas.com.
About Xperi Corporation
Xperi Corporation (Nasdaq: XPER) and its brands, DTS, FotoNation, HD
Radio, Invensas and Tessera, are dedicated to creating innovative
technology solutions that enable extraordinary experiences for people
around the world. Xperi's solutions are licensed by hundreds of leading
global partners and have shipped in billions of products in areas
including premium audio, broadcast, automotive, computational imaging,
computer vision, mobile computing and communications, memory, data
storage, and 3D semiconductor interconnect and packaging. For more
information, please call 408-321-6000 or visit www.xperi.com.
About Teledyne DALSA
Teledyne DALSA is an international technology leader in sensing,
imaging, and specialized semiconductor fabrication. Our image sensing
solutions span the spectrum from infrared through visible to X-ray; our
MEMS foundry has earned a world-leading reputation. In addition, through
our subsidiaries Teledyne Optech and Teledyne Caris, we deliver advanced
3D survey and geospatial information systems. Teledyne DALSA employs
approximately 1,400 employees worldwide and is headquartered in
Waterloo, Canada. For more information, visit www.teledynedalsa.com.
Xperi, Invensas, and their respective logos are trademarks or
registered trademarks of affiliated companies of Xperi Corporation in
the United States and other countries. All other company, brand and
product names may be trademarks or registered trademarks of their
respective companies.
SOURCE: XPERI CORPORATION
XPER-I
View source version on businesswire.com: http://www.businesswire.com/news/home/20171214005411/en/
Xperi PR Agency:
The Brand Amp
Nicole Fait, +1
949-438-1104
nicolef@thebrandamp.com
or
Xperi
PR:
Jordan Miller, +1 818-436-1082
jordan.miller@xperi.com
or
Xperi
Investor Relations:
Geri Weinfeld, +1 818-436-1231
geri.weinfeld@xperi.com
or
Teledyne
Media:
Geralyn Miller, +1 519-886-6000
geralyn.miller@teledyne.com
Source: Xperi Corporation
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