Press Releases

Invensas Completes DBI Technology Transfer to Teledyne DALSA
One of the world's largest independent MEMS foundries ready to manufacture MEMS and image sensor products utilizing Invensas wafer bonding and 3D interconnect technology SAN JOSE, Calif. --(BUSINESS WIRE)-- Invensas, a wholly owned subsidiary of Xperi Corporation ("Xperi") (NASDAQ:XPER), today
Dec 14, 2017
Invensas DBI Technology Now Available at SMIC
Leading semiconductor foundry ready to manufacture Invensas wafer bonding and 3D interconnect technology for image sensor solutions SAN JOSE, Calif. --(BUSINESS WIRE)-- Semiconductor Manufacturing International Corporation ("SMIC") ( NYSE : SMI; SEHK: 981), one of the leading semiconductor
Nov 08, 2017
OmniVision Signs License Agreement with Ziptronix
Ziptronix Litigation with OmniVision and TSMC Resolved SAN JOSE, Calif. --(BUSINESS WIRE)-- Tessera Holding Corporation (NASDAQ:TSRA) (the "Company" or "Tessera") today announced that its subsidiary Ziptronix, Inc. ("Ziptronix") reached an agreement with OmniVision Technologies, Inc.
Feb 21, 2017
Invensas Wins 2016 3D InCites Supplier of the Year Award
Award Recognizes Leading Edge Zibond® and DBI® Bonding & Interconnect Technologies SAN JOSE, Calif. --(BUSINESS WIRE)-- Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that its wholly owned subsidiary Invensas Corporation received the 2016 3D InCites Supplier of the Year and Fabless of
Jul 13, 2016
Invensas Signs BVA Technology License and Development Agreement with ASE
Invensas BVA® Technology Enables Low Cost, Low Profile, Scalable Package-on-Package Solution for Future Generations of Application Processors and SiP Solutions SAN JOSE, Calif. --(BUSINESS WIRE)-- Tessera Technologies, Inc. (Nasdaq:TSRA), announced today that its wholly owned subsidiary Invensas
May 02, 2016