SAN JOSE, Calif.--(BUSINESS WIRE)--
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies,
Inc. (Nasdaq:TSRA), today announced that Tong Hsing Electronic
Industries Ltd., a leading Taiwanese provider of microelectronic
packaging and substrate manufacturing services, has entered into a
license agreement for Invensas' Bond Via Array™ (BVA®) vertical
interconnect technology. In addition, the companies have completed
technology transfer and qualification of the BVA platform.
The increasing functionality of smartphones, wearables and Internet of
Things (IoT) devices is driving a requirement for low cost, small
form-factor micro-electromechanical systems (MEMS) devices and
system-in-package (SiP) solutions. BVA readily addresses this market
requirement by leveraging existing manufacturing infrastructure and
eliminating the need for expensive interconnect processes such as laser
drilling, copper plating or through-silicon-vias.
"Cost effective and robust vertical interconnect technology is
critically important for the miniaturization of next generation
electronics," said Craig Mitchell, President of Invensas. "We are
pleased with our collaboration with Tong Hsing to commercialize BVA
technology to meet this market need and look forward to continuing our
partnership."
"It has been a great pleasure to work with Invensas team to evaluate and
qualify the BVA technology platform," said Heinz Ru, President of Tong
Hsing. "We look forward to providing BVA packaging services to the MEMS
industry."
About Tessera Technologies, Inc.
Tessera Technologies, Inc., including its Invensas, FotoNation and
Ziptronix subsidiaries, licenses technologies and intellectual property
to customers for use in areas such as mobile computing and
communications, memory and data storage, and 3D-IC technologies, among
others. Our technologies include semiconductor packaging and
interconnect solutions, and products and solutions for mobile and
computational imaging, including our LifeFocusTM, FaceToolsTM,
FacePowerTM, FotoSavvyTM, DigitalApertureTM,
face beautification, red-eye removal, High Dynamic Range, autofocus,
panorama, and image stabilization intellectual property. For more
information call +1.408.321.6000 or visit www.tessera.com or www.invensas.com.
Tessera, the Tessera logo, FotoNation, the FotoNation logo, Ziptronix,
the Ziptronix logo, FaceSavvy, FaceTools, FacePower, DigitalAperture,
and LifeFocus are trademarks or registered trademarks of affiliated
companies of Tessera Technologies, Inc. in the United States and other
countries. All other company, brand and product names may be trademarks
or registered trademarks of their respective companies.
Safe Harbor Statement
This document contains forward-looking statements, which are made
pursuant to the safe harbor provisions of the Private Securities
Litigation Reform Act of 1995. Forward-looking statements involve risks
and uncertainties that could cause actual results to differ
significantly from those projected, particularly with respect to the
characteristics, benefits, and features of BVA technology and the use of
BVA by Tong Hsing. Material factors that may cause results to differ
from the statements made include the plans or operations relating to the
businesses of Tessera Technologies, Inc. (the "Company"); market or
industry conditions; changes in patent laws, regulation or enforcement,
or other factors that might affect the Company's ability to protect or
realize the value of its intellectual property; the expiration of
license agreements and the cessation of related royalty income; the
failure, inability or refusal of licensees to pay royalties; initiation,
delays, setbacks or losses relating to the Company's intellectual
property or intellectual property litigations, or invalidation or
limitation of key patents; fluctuations in operating results due to the
timing of new license agreements and royalties, or due to legal costs;
the risk of a decline in demand for semiconductors and products
utilizing FotoNation technologies; failure by the industry to use
technologies covered by the Company's patents; the expiration of the
Company's patents; the Company's ability to successfully complete and
integrate acquisitions of businesses; the risk of loss of, or decreases
in production orders from, customers of acquired businesses; financial
and regulatory risks associated with the international nature of the
Company's businesses; failure of the Company's products to achieve
technological feasibility or profitability; failure to successfully
commercialize the Company's products; changes in demand for the products
of the Company's customers; limited opportunities to license
technologies due to high concentration in the markets for semiconductors
and related products and smartphone imaging; and the impact of competing
technologies on the demand for the Company's technologies. You are
cautioned not to place undue reliance on the forward-looking statements,
which speak only as of the date of this release. The Company's filings
with the Securities and Exchange Commission, including its Annual Report
on Form 10-K for the year ended Dec. 31, 2014 and its Quarterly Report
on Form 10-Q for the quarter ended Sept. 30, 2015, include more
information about factors that could affect the Company's financial
results. The Company assumes no obligation to update information
contained in this press release. Although this release may remain
available on the Company's website or elsewhere, its continued
availability does not indicate that the Company is reaffirming or
confirming any of the information contained herein.
TSRA-I
View source version on businesswire.com: http://www.businesswire.com/news/home/20151202005276/en/
Tessera Technologies, Inc.
Peter Van Deventer, 916-337-0853
Chief
Marketing Officer
pvandeventer@tessera.com
or
Impress
Labs
Amy Smith, 401-369-9266
amy@impresslabs.com
Source: Tessera Technologies, Inc.
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