SAN JOSE, Calif.--(BUSINESS WIRE)--
Ziptronix, Inc., a wholly owned subsidiary of Tessera Technologies, Inc.
(NASDAQ:TSRA) ("Tessera" or the "Company") and the leader in low
temperature wafer bonding technology, today announced it has entered
into a development agreement with Fraunhofer IZM-ASSID ("Fraunhofer").
The companies will work together to integrate Ziptronix Direct Bond
Interconnect (DBI®) technology into Fraunhofer's state of the art 300mm
wafer production line and demonstrate DBI as the industry's finest
pitch, thinnest and lowest total cost-of-ownership 3D integration
solution.
Increasingly, the industry is looking toward 2.5D and 3D-IC solutions as
the most cost effective and efficient means of delivering the next
generation of high performance computing and consumer electronic
products. However, conventional approaches rely heavily on thru silicon
vias (TSVs), micro-bumping and underfill, which can limit interconnect
density, performance, form factor and cost-effectiveness. Ziptronix DBI
technology can address these limitations and accelerate the adoption of
game-changing 2.5D and 3D-IC architectures.
"Although great progress has been made, the industry continues to face
challenges associated with the manufacturability, scalability and cost
of current 2.5D and 3D-IC solutions. Ziptronix's DBI technology is an
enabling platform that can readily address many of these challenges,"
said Juergen Wolf, Head of Fraunhofer IZM-ASSID. "We at Fraunhofer are
very excited to work with Ziptronix to demonstrate the benefits of DBI
technology to our customers on our 300mm wafer production line."
"DBI is the industry's highest density, highest performance, lowest
profile and lowest cost-of-ownership 3D integration platform," said Paul
Enquist, Vice President of 3D R&D at Ziptronix. "It will revolutionize
the world's most challenging 3D-IC structures and devices, and we look
forward to working closely with Fraunhofer to demonstrate this enabling
capability to customers around the world."
"The acquisition of Ziptronix, and the subsequent integration of its
team and technology into Tessera, has allowed us to significantly expand
the 2.5D and 3D value that we bring to our customers, and the response
has been incredibly positive," said Craig Mitchell, President of
Invensas. "This development agreement with Fraunhofer is an important
step in the continuing development of the DBI technology as we grow our
2.5D and 3D product offerings."
Safe Harbor Statement
Forward-looking statements involve risks and uncertainties that could
cause actual results to differ significantly from those projected,
particularly with respect to the characteristics, benefits, and features
of DBI and Ziptronix's agreement with Fraunhofer. Material factors that
may cause results to differ from the statements made include the plans
or operations relating to the Company's businesses; market or industry
conditions; changes in patent laws, regulation or enforcement, or other
factors that might affect the Company's ability to protect or realize
the value of its intellectual property; the expiration of license
agreements and the cessation of related royalty income; the failure,
inability or refusal of licensees to pay royalties; initiation, delays,
setbacks or losses relating to the Company's intellectual property or
intellectual property litigations, or invalidation or limitation of key
patents; fluctuations in operating results due to the timing of new
license agreements and royalties, or due to legal costs; the risk of a
decline in demand for semiconductors and products utilizing FotoNation
technologies; failure by the industry to use technologies covered by the
Company's patents; the expiration of the Company's patents; the
Company's ability to successfully complete and integrate acquisitions of
businesses; the risk of loss of, or decreases in production orders from,
customers of acquired businesses; financial and regulatory risks
associated with the international nature of the Company's businesses;
failure of the Company's products to achieve technological feasibility
or profitability; failure to successfully commercialize the Company's
products; changes in demand for the products of the Company's customers;
limited opportunities to license technologies due to high concentration
in the markets for semiconductors and related products and smartphone
imaging; and the impact of competing technologies on the demand for the
Company's technologies. You are cautioned not to place undue reliance on
the forward-looking statements, which speak only as of the date of this
release. The Company's filings with the Securities and Exchange
Commission, including its Annual Report on Form 10-K for the year ended
Dec. 31, 2014 and its Quarterly Report on Form 10-Q for the quarter
ended June 30, 2015, include more information about factors that could
affect the Company's financial results. The Company assumes no
obligation to update information contained in this press release.
Although this release may remain available on the Company's website or
elsewhere, its continued availability does not indicate that the Company
is reaffirming or confirming any of the information contained herein.
About Ziptronix
A pioneer in the development of low temperature direct bond technology,
Ziptronix offers patented technology for wafer or die level bonding. Its
ZiBond® and DBI Hybrid Bonding™ technologies deliver the industry's most
scalable, manufacturable and lowest total cost-of-ownership solutions
for 3D stacking. The company's intellectual property has been licensed
for a variety of semiconductor applications including
backside-illuminated sensors, RF front ends, pico-projectors, memories
and 3D integrated circuits. Founded in 2000 as a venture-backed spinoff
of RTI International, Ziptronix is a wholly owned subsidiary of Tessera
Technologies, Inc. The company holds more than 35 U.S. patents and more
than 20 international patents, with more than 45 U.S. and international
patent applications pending. For more information, visit http://www.ziptronix.com.
About Fraunhofer IZM-ASSID
Fraunhofer IZM is a worldwide renowned institute specializing in
developing advanced packaging and system integration technologies and
transferring research results to the industry. The center "All Silicon
System Integration Dresden - ASSID" operates Fraunhofer IZM's
leading-edge, industry-compatible 200/300mm 3D wafer-level process line
with modules for TSV formation, TSV post-processing, pre-assembly,
wafer-level assembly, stack formation and related metrology tools. ASSID
is focusing on process development, material and equipment evaluation as
well as R&D services. Fraunhofer IZM-ASSID has established cooperation
and joint development programs with industrial partners for undertaking
material and equipment evaluation, process development as well as
process and product integration.
About Tessera Technologies, Inc.
Tessera Technologies, Inc., including its Invensas, FotoNation and
Ziptronix subsidiaries, licenses its technologies and intellectual
property to customers for use in areas such as mobile computing and
communications, memory and data storage, and 3DIC technologies, among
others. Our technologies include semiconductor packaging and
interconnect solutions, and products and solutions for mobile and
computational imaging, including our FaceToolsTM, FacePowerTM,
FotoSavvyTM, DigitalApertureTM, LifeFocusTM,
face beautification, red-eye removal, High Dynamic Range, autofocus,
panorama, and image stabilization intellectual property. For more
information call 1.408.321.6000 or visit www.tessera.com.
Tessera, the Tessera logo, FotoNation, the FotoNation logo, Ziptronix,
the Ziptronix logo, DBI, FaceSavvy, FaceTools, FacePower,
DigitalAperture, and LifeFocus are trademarks or registered trademarks
of affiliated companies of Tessera Technologies, Inc. in the United
States and other countries. All other company, brand and product names
may be trademarks or registered trademarks of their respective companies.
TSRA-I
View source version on businesswire.com: http://www.businesswire.com/news/home/20151029005307/en/
Tessera Technologies, Inc.
Robert Andersen, 408-321-6779
Executive
Vice President and Chief Financial Officer
or
The Piacente
Group | Investor Relations
Don Markley, 212-481-2050
Tessera@tpg-ir.com
or
Impress
Labs
Henri Viès, 650-776-9289
henri@impresslabs.com
Source: Tessera Technologies, Inc.
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