SAN JOSE, Calif.--(BUSINESS WIRE)--
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies,
Inc., (Nasdaq:TSRA) announced today that Fraunhofer EMFT has signed a
new license agreement to incorporate ZiBond® and Direct Bond
Interconnect (DBI®) technologies into their portfolio of foundry
services. This agreement expands Fraunhofer EMFT's world-class MEMS
manufacturing capabilities with the most advanced 3D integration
technologies available.
"ZiBond and DBI technologies are truly enabling bonding and 3D
integration technologies for next generation electronic products," said
Dr. Peter Ramm, department head, Heterogeneous System Integration at
Fraunhofer EMFT. "We look forward to working with Invensas and our
global customer base to demonstrate and further optimize these
technologies for MEMS applications on our production equipment," added
Prof. Dr. Christoph Kutter, director of Fraunhofer EMFT.
ZiBond and DBI technologies are cost-effective, versatile 2.5D and 3D
semiconductor integration solutions that enable leading edge
functionality and accelerate time to market for MEMS and multiple other
semiconductor products. ZiBond and DBI bonding can be performed at room
temperature without requiring bond pressure. Bonding is typically
completed in less than a minute for an entire wafer, substantially
reducing manufacturing cost.
"Scaling based on Moore's Law is becoming increasingly challenging and
this is driving demand for our ZiBond and DBI bonding and 3D
interconnect technologies, which have been proven in high volume
production environments," said Craig Mitchell, president of Invensas
Corporation. "We are pleased that Fraunhofer EMFT, a highly respected
MEMS research and 3D heterogeneous integration, development and pilot
manufacturing center of excellence, has chosen our ZiBond and DBI
technologies to help their customers accelerate the development and
commercialization of their next generation MEMS products."
For more information on ZiBond, DBI and other Invensas solutions, please
visit www.invensas.com
or www.tessera.com.
About Tessera Technologies, Inc.
Tessera Technologies, Inc., including its Invensas and
FotoNation subsidiaries, licenses technologies and intellectual property
to customers for use in areas such as mobile computing and
communications, memory and data storage, and 3D-IC technologies, among
others. Our technologies include semiconductor packaging and
interconnect solutions, and computational imaging and computer vision
products and solutions for mobile and other vision systems. For more
information call +1.408.321.6000 or visit www.tessera.com or www.invensas.com.
Tessera, the Tessera logo, Invensas, the Invensas logo, are trademarks
or registered trademarks of affiliated companies of Tessera
Technologies, Inc. in the United States and other countries. All other
company, brand and product names may be trademarks or registered
trademarks of their respective companies.
About Fraunhofer EMFT
Fraunhofer EMFT conducts cutting-edge applied research into sensors and
actuators for people and the environment. The core competences of the
research departments in Munich with hundred employees include the fields
of silicon technologies, devices and 3D integration, as well as foil
technologies, micropumps, sensor materials and the capability of system
integration. The real strength of Fraunhofer EMFT lies in the
interaction between these areas: after all, innovations often emerge
where technologies reach their limits and begin to cross-fertilize.
Safe Harbor Statement
This press release contains forward-looking statements, which are made
pursuant to the safe harbor provisions of the Private Securities
Litigation Reform Act of 1995. Forward-looking statements involve risks
and uncertainties that could cause actual results to differ
significantly from those projected, particularly with respect to the
agreement with Fraunhofer and the features, benefits and characteristics
of ZiBond and DBI. Material factors that may cause results to differ
from the statements made include the plans or operations relating to the
businesses of Tessera Technologies, Inc. (the "Company"); market or
industry conditions; changes in patent laws, regulation or enforcement,
or other factors that might affect the Company's ability to protect or
realize the value of its intellectual property; the expiration of
license agreements and the cessation of related royalty income; the
failure, inability or refusal of licensees to pay royalties; initiation,
delays, setbacks or losses relating to the Company's intellectual
property or intellectual property litigations, or invalidation or
limitation of key patents; fluctuations in operating results due to the
timing of new license agreements and royalties, or due to legal costs;
the risk of a decline in demand for semiconductors and products
utilizing FotoNation technologies; failure by the industry to use
technologies covered by the Company's patents; the expiration of the
Company's patents; the Company's ability to successfully complete and
integrate acquisitions of businesses; the risk of loss of, or decreases
in production orders from, customers of acquired businesses; financial
and regulatory risks associated with the international nature of the
Company's businesses; failure of the Company's products to achieve
technological feasibility or profitability; failure to successfully
commercialize the Company's products; changes in demand for the products
of the Company's customers; limited opportunities to license
technologies due to high concentration in the markets for semiconductors
and related products and smartphone imaging; and the impact of competing
technologies on the demand for the Company's technologies. You are
cautioned not to place undue reliance on the forward-looking statements,
which speak only as of the date of this release. The Company's filings
with the Securities and Exchange Commission, including its Annual Report
on Form 10-K for the year ended Dec. 31, 2015 and its Quarterly Report
on Form 10-Q for the quarter ended June 30, 2016, include more
information about factors that could affect the Company's financial
results. The Company assumes no obligation to update information
contained in this press release. Although this release may remain
available on the Company's website or elsewhere, its continued
availability does not indicate that the Company is reaffirming or
confirming any of the information contained herein.
TSRA-I
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Contact
Tessera Technologies
Adolph Hunter, +1 408-321-6710
ahunter@tessera.com
Source: Tessera Technologies, Inc.
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