Proven 2.5D and 3D Semiconductor Integration Technologies to be
Incorporated in Next Generation National Laboratory Research
SAN JOSE, Calif.--(BUSINESS WIRE)--
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies,
Inc. (NASDAQ:TSRA), announced today that Sandia National Laboratories
signed a new license agreement for ZiBond® and Direct Bond Interconnect
(DBI®) technologies. With this license Sandia will have access to the
most advanced 3D integration technologies available, for use in a wide
range of semiconductor applications.
For more than 60 years, Sandia National Laboratories has been the
premier science and engineering laboratory in the United States for
national security and innovation. Working closely with U.S. government
agencies, private industry and academic institutions, Sandia has led the
charge to research, develop and deliver essential technologies used to
solve many of the nation's most important security, climate change and
sustainable energy challenges.
"The demand for cost-effective, versatile, 2.5D and 3D integration
technologies has risen significantly, as research and commercial
enterprises seek to expand overall performance and functionality of
electronics products," said Craig Mitchell, President, Invensas
Corporation. "ZiBond and DBI technologies are currently deployed in
leading edge semiconductor products, and we are pleased to now make them
available to Sandia, a premier government research institution."
ZiBond is a low-temperature homogeneous bonding technology that enables
room temperature die or wafer-level 3D integration, without the need for
the application of external pressure. DBI is a low-temperature, hybrid
bonding technology with integrated electrical interconnects, that offers
the industry's finest pitch and lowest cost-of-ownership 3D interconnect
platform.
Both ZiBond and DBI deliver the fastest bonding throughput currently
available in the industry, resulting in up to a 15x increase in wafer
bonding throughput. Both technologies offer the thinnest available 2.5D
and 3D semiconductor assemblies, while reducing wafer warpage,
increasing reliability and improving thermal performance. Additionally,
low processing temperatures significantly reduce equipment and process
cost for high volume manufacturing.
For more information on ZiBond and DBI technologies as well as other
Invensas solutions, please visit www.invensas.com
or www.tessera.com.
About Tessera Technologies, Inc.
Tessera Technologies, Inc., including its Invensas and
FotoNation subsidiaries, licenses technologies and intellectual property
to customers for use in areas such as mobile computing and
communications, memory and data storage, and 3D-IC technologies, among
others. Our technologies include semiconductor packaging and
interconnect solutions, and products and solutions for mobile and
computational imaging, including our LifeFocusTM, FaceToolsTM,
FacePowerTM, FotoSavvyTM, DigitalApertureTM,
face beautification, red-eye removal, High Dynamic Range, autofocus,
panorama, and image stabilization intellectual property. For more
information call +1.408.321.6000 or visit www.tessera.com or www.invensas.com.
Tessera, the Tessera logo, FotoNation, the FotoNation logo, ZiBond, DBI,
FaceSavvy, FaceTools, FacePower, DigitalAperture, and LifeFocus are
trademarks or registered trademarks of affiliated companies of Tessera
Technologies, Inc. in the United States and other countries. All other
company, brand and product names may be trademarks or registered
trademarks of their respective companies.
Safe Harbor Statement
This press release contains forward-looking statements, which are made
pursuant to the safe harbor provisions of the Private Securities
Litigation Reform Act of 1995. Forward-looking statements involve risks
and uncertainties that could cause actual results to differ
significantly from those projected, particularly with respect to the
characteristics, benefits, and features of ZiBond and DBI technologies
and the use of such technologies by Sandia National Laboratories.
Material factors that may cause results to differ from the statements
made include the plans or operations relating to the businesses
of Tessera Technologies, Inc. (the "Company"); market or industry
conditions; changes in patent laws, regulation or enforcement, or other
factors that might affect the Company's ability to protect or realize
the value of its intellectual property; the expiration of license
agreements and the cessation of related royalty income; the failure,
inability or refusal of licensees to pay royalties; initiation, delays,
setbacks or losses relating to the Company's intellectual property or
intellectual property litigations, or invalidation or limitation of key
patents; fluctuations in operating results due to the timing of new
license agreements and royalties, or due to legal costs; the risk of a
decline in demand for semiconductors and products
utilizing FotoNation technologies; failure by the industry to use
technologies covered by the Company's patents; the expiration of the
Company's patents; the Company's ability to successfully complete and
integrate acquisitions of businesses; the risk of loss of, or decreases
in production orders from, customers of acquired businesses; financial
and regulatory risks associated with the international nature of the
Company's businesses; failure of the Company's products to achieve
technological feasibility or profitability; failure to successfully
commercialize the Company's products; changes in demand for the products
of the Company's customers; limited opportunities to license
technologies due to high concentration in the markets for semiconductors
and related products and smartphone imaging; and the impact of competing
technologies on the demand for the Company's technologies. You are
cautioned not to place undue reliance on the forward-looking statements,
which speak only as of the date of this release. The Company's filings
with the Securities and Exchange Commission, including its Annual Report
on Form 10-K for the year ended Dec. 31, 2015, include more information
about factors that could affect the Company's financial results. The
Company assumes no obligation to update information contained in this
press release. Although this release may remain available on the
Company's website or elsewhere, its continued availability does not
indicate that the Company is reaffirming or confirming any of the
information contained herein.
TSRA-I
View source version on businesswire.com: http://www.businesswire.com/news/home/20160418005510/en/
Tessera Technologies
Adolph Hunter, +1 408-321-6710
ahunter@tessera.com
or
Zeno
Group
Dan Sorensen, +1 650-801-0944
dan.sorensen@zenogroup.com
Source: Tessera Technologies, Inc.
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