Invensas BVA® Technology Enables Low Cost, Low Profile, Scalable
Package-on-Package Solution for Future Generations of Application
Processors and SiP Solutions
SAN JOSE, Calif.--(BUSINESS WIRE)--
Tessera Technologies, Inc. (Nasdaq:TSRA), announced today that its
wholly owned subsidiary Invensas Corporation signed a new technology
license and development agreement with Advanced Semiconductor
Engineering, Inc. ("ASE") (TAIEX:2311, NYSE:ASX), the world's largest
semiconductor assembly and test service provider, to collaborate on the
development and commercialization of Invensas Bond Via Array™ (BVA®)
technology. ASE will move to the final stage of qualification of
Invensas BVA® vertical interconnect technology for Package-on-Package
(PoP) applications and begin engaging customers. With Invensas BVA
technology, ASE will be able to meet its customers' desire for low
profile and low cost PoP solutions for current and future generations of
application processors aimed at smartphones and tablets.
Consumer demand for smaller and more advanced mobile electronics creates
ever more challenging requirements for chip packaging technologies.
Overall package height and assembly cost must be maintained or reduced
while accommodating larger and higher performance application
processors. Invensas BVA technology enables device manufacturers to
address these competing needs, delivering better performance in smaller
packages, all while using existing wire bonding manufacturing
infrastructure.
"Tessera is a valued partner for ASE, and we are pleased to expand the
technology and business relationship between our two companies," said
Tien Wu, Chief Operating Officer of ASE. "The Invensas BVA technology
will enable us to deliver advanced packaging solutions that will enable
us to continue to satisfy our customers' requirements for integrated,
low profile, cost-effective advanced packaging solutions."
Invensas BVA technology provides the industry with unmatched tolerance
to process variations, which translates into improved yield and cost
efficiencies. Further, this technology can be used to provide a cost
effective 3D interconnect solution, for System-in-Package (SiP) and a
range of other applications.
"We are excited to enter into this agreement with ASE and look forward
to continuing to work closely together to proliferate Invensas BVA and
future technologies into the market," said Tom Lacey, CEO, Tessera
Technologies, Inc. "This agreement paves the way for both companies to
deliver next-generation packaging solutions for a diverse range of end
products, including smartphones, tablets, and other mobile electronics."
The companies anticipate that advanced packaging capabilities featuring
Invensas BVA technology will be available to ASE customers in the second
half of 2016. For more information on Invensas BVA technology and other
Invensas solutions, please visit www.invensas.com
or www.tessera.com.
About Tessera Technologies, Inc.
Tessera Technologies, Inc., including its Invensas and
FotoNation subsidiaries, licenses technologies and intellectual property
to customers for use in areas such as mobile computing and
communications, memory and data storage, and 3D-IC technologies, among
others. Our technologies include semiconductor packaging and
interconnect solutions, and products and solutions for mobile and
computational imaging, including our LifeFocusTM, FaceToolsTM,
FacePowerTM, FotoSavvyTM, DigitalApertureTM,
face beautification, red-eye removal, High Dynamic Range, autofocus,
panorama, and image stabilization intellectual property. For more
information call +1.408.321.6000 or visit www.tessera.com or www.invensas.com.
Tessera, the Tessera logo, Invensas, the Invensas logo, BVA, FotoNation,
the FotoNation logo, FaceSavvy, FaceTools, FacePower, DigitalAperture,
and LifeFocus are trademarks or registered trademarks of affiliated
companies of Tessera Technologies, Inc. in the United States and other
countries. All other company, brand and product names may be trademarks
or registered trademarks of their respective companies.
About ASE Group
Advanced Semiconductor Engineering, Inc. (ASE Group) is the world's
largest provider of independent semiconductor manufacturing services in
assembly, test, materials and design manufacturing. As a global leader
geared toward meeting the industry's ever-growing needs for faster,
smaller and higher performance chips, ASE develops and offers a wide
portfolio of technology and solutions including IC test program design,
front-end engineering test, wafer probe, wafer bump, substrate design
and supply, wafer level package, flip chip, System in Package (SiP),
final test and electronic manufacturing services. ASE generated sales
revenues of US $8.64 billion in 2015 and employs over 65,000 people
worldwide. For more information about ASE Group, visit www.aseglobal.com.
Safe Harbor Statement
This press release contains forward-looking statements, which are made
pursuant to the safe harbor provisions of the Private Securities
Litigation Reform Act of 1995. Forward-looking statements involve risks
and uncertainties that could cause actual results to differ
significantly from those projected, particularly with respect to the
characteristics, benefits, and features of BVA technology and the use of
such technologies by ASE. Material factors that may cause results to
differ from the statements made include the plans or operations relating
to the businesses of Tessera Technologies, Inc. (the "Company"); market
or industry conditions; changes in patent laws, regulation or
enforcement, or other factors that might affect the Company's ability to
protect or realize the value of its intellectual property; the
expiration of license agreements and the cessation of related royalty
income; the failure, inability or refusal of licensees to pay royalties;
initiation, delays, setbacks or losses relating to the Company's
intellectual property or intellectual property litigations, or
invalidation or limitation of key patents; fluctuations in operating
results due to the timing of new license agreements and royalties, or
due to legal costs; the risk of a decline in demand for semiconductors
and products utilizing FotoNation technologies; failure by the industry
to use technologies covered by the Company's patents; the expiration of
the Company's patents; the Company's ability to successfully complete
and integrate acquisitions of businesses; the risk of loss of, or
decreases in production orders from, customers of acquired businesses;
financial and regulatory risks associated with the international nature
of the Company's businesses; failure of the Company's products to
achieve technological feasibility or profitability; failure to
successfully commercialize the Company's products; changes in demand for
the products of the Company's customers; limited opportunities to
license technologies due to high concentration in the markets for
semiconductors and related products and smartphone imaging; and the
impact of competing technologies on the demand for the Company's
technologies. You are cautioned not to place undue reliance on the
forward-looking statements, which speak only as of the date of this
release. The Company's filings with the Securities and Exchange
Commission, including its Annual Report on Form 10-K for the year
ended Dec. 31, 2015, include more information about factors that could
affect the Company's financial results. The Company assumes no
obligation to update information contained in this press release.
Although this release may remain available on the Company's website or
elsewhere, its continued availability does not indicate that the Company
is reaffirming or confirming any of the information contained herein.
TSRA-I
View source version on businesswire.com: http://www.businesswire.com/news/home/20160502005405/en/
Zeno Group
Dan Sorensen, +1 650-801-0944
dan.sorensen@zenogroup.com
Source: Tessera Technologies, Inc.
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