Award Recognizes Leading Edge Zibond® and DBI® Bonding & Interconnect
Technologies
SAN JOSE, Calif.--(BUSINESS WIRE)--
Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that its
wholly owned subsidiary Invensas Corporation received the 2016 3D
InCites Supplier of the Year and Fabless of the Year Awards. These
awards were presented at SEMICON
West on July 12 by 3D InCites and Impress Foundation at the fourth
annual celebration to honor the industry's best 3D IC companies,
solutions and achievements.
"We are honored to be named winners in both the Supplier of the Year and
Fabless of the Year categories of this competition," said Craig
Mitchell, president, Invensas. "Our 3D integration platforms are in high
volume production today and we believe will be essential to
next-generation high-performance logic, memory, MEMS and image sensor
solutions."
The 3D InCites Awards were established in 2013 to recognize achievements
that further the commercialization of interposer and 3D integration
technologies. In 2015, many of these technologies became productized,
and are being recognized as part of the overall advanced packaging
landscape for the value they bring to today's electronic devices.
"Invensas has clearly demonstrated its 3D IC vision and its ability to
develop and bring advanced new solutions to market," said Françoise von
Trapp, founder of 3D InCites. "This is a banner year for 3D integration
and packaging, and it has been encouraging to see these technologies
feature so prominently at SEMICON West."
For more information on Invensas and Invensas solutions, please visit www.invensas.com
or www.tessera.com.
About Tessera Technologies, Inc.
Tessera Technologies, Inc., including its Invensas and
FotoNation subsidiaries, licenses technologies and intellectual property
to customers for use in areas such as mobile computing and
communications, memory and data storage, and 3D IC technologies, among
others. Our technologies include semiconductor packaging and
interconnect solutions, and computational imaging and computer vision
products and solutions for mobile and other vision systems. For more
information call +1.408.321.6000 or visit www.tessera.com or www.invensas.com.
About 3D InCites
3D InCites is the fastest growing online resource devoted exclusively to
interposer integration 3D IC, and 3D heterogeneous integration
technologies. For 3D integration to happen requires open collaboration
across the supply chain. Therefore, 3D InCites strives to inform key
decision makers about progress in technology development, design,
standards, and infrastructure in order to realize commercial production
of interposer integration and 3D IC technologies. For more information
visit www.3DinCites.com.
Tessera, the Tessera logo, Invensas, the Invensas logo, Zibond and DBI
are trademarks or registered trademarks of affiliated companies
of Tessera Technologies, Inc. in the United States and other countries.
All other company, brand and product names may be trademarks or
registered trademarks of their respective companies.
Safe Harbor Statement
This press release contains forward-looking statements, which are made
pursuant to the safe harbor provisions of the Private Securities
Litigation Reform Act of 1995. Forward-looking statements involve risks
and uncertainties that could cause actual results to differ
significantly from those projected, particularly with respect to the
potential future uses of 3D IC technologies in next generation
solutions. Material factors that may cause results to differ from the
statements made include the plans or operations relating to the
businesses of Tessera Technologies, Inc. (the "Company"); market or
industry conditions; changes in patent laws, regulation or enforcement,
or other factors that might affect the Company's ability to protect or
realize the value of its intellectual property; the expiration of
license agreements and the cessation of related royalty income; the
failure, inability or refusal of licensees to pay royalties; initiation,
delays, setbacks or losses relating to the Company's intellectual
property or intellectual property litigations, or invalidation or
limitation of key patents; fluctuations in operating results due to the
timing of new license agreements and royalties, or due to legal costs;
the risk of a decline in demand for semiconductors and products
utilizing FotoNation technologies; failure by the industry to use
technologies covered by the Company's patents; the expiration of the
Company's patents; the Company's ability to successfully complete and
integrate acquisitions of businesses; the risk of loss of, or decreases
in production orders from, customers of acquired businesses; financial
and regulatory risks associated with the international nature of the
Company's businesses; failure of the Company's products to achieve
technological feasibility or profitability; failure to successfully
commercialize the Company's products; changes in demand for the products
of the Company's customers; limited opportunities to license
technologies due to high concentration in the markets for semiconductors
and related products and smartphone imaging; and the impact of competing
technologies on the demand for the Company's technologies. You are
cautioned not to place undue reliance on the forward-looking statements,
which speak only as of the date of this release. The Company's filings
with the Securities and Exchange Commission, including its Annual Report
on Form 10-K for the year ended Dec. 31, 2015 and its Quarterly Report
on Form 10-Q for the quarter ended Mar. 31, 2016, include more
information about factors that could affect the Company's financial
results. The Company assumes no obligation to update information
contained in this press release. Although this release may remain
available on the Company's website or elsewhere, its continued
availability does not indicate that the Company is reaffirming or
confirming any of the information contained herein.
TSRA-I

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PR Agency Contact:
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Dan Sorensen, +1-650-801-0944
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or
Company
Contact:
Tessera Technologies
Adolph Hunter, +1-408-321-6710
ahunter@tessera.com
Source: Tessera Technologies, Inc.
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