SAN JOSE, Calif.--(BUSINESS WIRE)--
Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that its
wholly owned subsidiary Invensas Corporation will exhibit advanced
bonding and 3D interconnect solutions at the upcoming European MEMS
Summit, taking place September 15-16 in Stuttgart, Germany.
Sitaram Arkalgud, vice president, 3D Applications at Invensas will
deliver a presentation titled, "Using Low Cost of Ownership Direct
Bonding Technologies for MEMS Applications."
What: European MEMS Summit
Date: September 15-16, 2016
Location:
Maritim Hotel Stuttgart, Stuttgart, Germany
Booth Number: 14
Registration
Information: Conference attendees can register for the show at http://semi.inviteo.fr/EuropeanMEMSSummit2016/.
Details: At the show, Invensas will showcase ZiBond® low
temperature homogeneous, direct bonding technology that forms a strong
bond between wafers or die with same or different coefficients of
thermal expansion. Invensas will also showcase Direct Bond Interconnect
(DBI®) low temperature hybrid direct bonding technology for wafer and
die level 3D interconnect applications.
ZiBond and DBI technologies are cost-effective, versatile 2.5D and 3D
semiconductor integration solutions that enable leading edge
functionality and accelerate time to market for MEMS and multiple other
semiconductor products.
For more information about ZiBond and DBI technologies, visit www.invensas.com.
About Tessera Technologies, Inc.
Tessera Technologies, Inc., including its Invensas and
FotoNation subsidiaries, licenses technologies and intellectual property
to customers for use in areas such as mobile computing and
communications, memory and data storage, and 3D IC technologies, among
others. Our technologies include semiconductor packaging and
interconnect solutions, and computational imaging and computer vision
products and solutions for mobile and other vision systems. For more
information call +1.408.321.6000 or visit www.tessera.com or www.invensas.com.
Tessera, the Tessera logo, Invensas, the Invensas logo, ZiBond and DBI,
are trademarks or registered trademarks of affiliated companies
of Tessera Technologies, Inc. in the United States and other countries.
All other company, brand and product names may be trademarks or
registered trademarks of their respective companies.
TSRA-I
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Or
Company
Contact:
Tessera Technologies, Inc.
Adolph Hunter, +1
408-321-6710
ahunter@tessera.com
Source: Tessera Technologies, Inc.
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