SAN JOSE, Calif.--(BUSINESS WIRE)--
Tessera Technologies, Inc. (Nasdaq:TSRA), announced today that its
wholly owned subsidiary Invensas Corporation will exhibit its low
temperature wafer bonding and 3D interconnect solutions at the upcoming
International Wafer-Level Packaging Conference 2016, taking place
October 18-20 in San Jose, Calif.
At the show, Guilian Gao, Ph.D., Principal Engineer at Invensas will
deliver a presentation titled, "Direct Bond Interconnect (DBI®)
Technology as an Alternative to Thermal Compression Bonding."
Additionally, Min Tao, Senior Manager of Advanced Packaging at Invensas
will deliver a presentation titled, "Package-on-Package Interconnect for
Fan-Out Wafer-Level Packages."
What: IWLPC 2016
Date: October 18-20, 2016
Location:
Doubletree by Hilton Hotel, San Jose, California
Booth Number: 41
Registration
Information: Conference attendees can register for the show at http://www.iwlpc.com/register_now.cfm.
Details:
At the show, Invensas will highlight its advanced wafer bonding
technology, ZiBond®, a low temperature homogeneous, direct bonding
technology that forms a strong bond between wafers or die with same or
different coefficients of thermal expansion. Invensas will also exhibit
Direct Bond Interconnect (DBI), its hybrid direct bonding technology for
wafer and die level 3D interconnect applications.
For more information about Invensas' advanced semiconductor packaging
technologies, visit www.invensas.com.
About Tessera Technologies, Inc.
Tessera Technologies, Inc., including its Invensas and
FotoNation subsidiaries, licenses technologies and intellectual property
to customers for use in areas such as mobile computing and
communications, memory and data storage, and 3D IC technologies, among
others. Our technologies include semiconductor packaging and
interconnect solutions, and computational imaging and computer vision
products and solutions for mobile and other vision systems. For more
information call +1.408.321.6000 or visit www.tessera.com or www.invensas.com.
Tessera, the Tessera logo, Invensas, the Invensas logo, ZiBond and DBI,
are trademarks or registered trademarks of affiliated companies
of Tessera Technologies, Inc. in the United States and other countries.
All other company, brand and product names may be trademarks or
registered trademarks of their respective companies.
TSRA-I
View source version on businesswire.com: http://www.businesswire.com/news/home/20161017005212/en/
PR Agency Contact:
Zeno Group
Dan Sorensen, +1 650-801-0944
Dan.sorensen@zenogroup.com
or
Company
Contact:
Tessera Technologies, Inc.
Adolph Hunter, +1
408-321-6710
ahunter@tessera.com
Source: Tessera Technologies, Inc.
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