Leading semiconductor foundry ready to manufacture Invensas wafer
bonding and 3D interconnect technology for image sensor solutions
SAN JOSE, Calif.--(BUSINESS WIRE)--
Semiconductor Manufacturing International Corporation ("SMIC") (NYSE:
SMI; SEHK: 981), one of the leading semiconductor foundries in the world
and the largest and most advanced foundry in mainland China, and
Invensas, a wholly owned subsidiary of Xperi Corporation ("Xperi")
(NASDAQ: XPER), today announced the establishment of Invensas' Direct
Bond Interconnect (DBI®) technology at SMIC's Avezzano
facility. This capability enables SMIC to support the growing demand for
high performance, hybrid stacked backside illuminated (BSI) image
sensors, as well as other semiconductor devices, in a wide range of end
applications including smartphones and automobiles. SMIC and Invensas
previously signed a Development License in March 2017.
"By working closely with the Invensas team, we have been able to quickly
bring in the DBI manufacturing process and are now prepared to offer DBI
for image sensors, MEMS sensor hubs, Power Management IC, and beyond to
our customers at 200mm," said Roberto Bez, vice president of technology
development at LFoundry, SMIC's subsidiary in Avezzano, Italy.
"Invensas' DBI technology enables SMIC to manufacture the high
performance image sensors required in mobile, automotive, and consumer
electronics applications," said Sunny Hui, senior vice president of
marketing at SMIC. "With this technology in place, SMIC is prepared to
further expand this capability into volume manufacturing around the
globe, both at 200mm and 300mm."
"SMIC's talented manufacturing team has done an excellent job
integrating our DBI process into their high-volume manufacturing
environment," said Craig Mitchell, president of Invensas. "We are
thrilled to announce that SMIC is ready to engage commercial customers
and support the demand for high volume production of BSI image sensors
with DBI. We look forward to continuing to work together to expand this
technology platform into other products and applications."
DBI technology is a low temperature hybrid wafer bonding solution that
allows wafers to be bonded with scalable fine pitch 3D electrical
interconnect without requiring bond pressure. DBI 3D interconnect can
eliminate the need for through-silicon vias (TSVs) and reduce die size
and cost while enabling pixel level interconnect for future generations
of image sensors.
About Xperi Corporation
Xperi Corporation (Nasdaq: XPER) and its brands, DTS, FotoNation, HD
Radio, Invensas and Tessera, are dedicated to creating innovative
technology solutions that enable extraordinary experiences for people
around the world. Xperi's solutions are licensed by hundreds of leading
global partners and have shipped in billions of products in areas
including premium audio, broadcast, automotive, computational imaging,
computer vision, mobile computing and communications, memory, data
storage, and 3D semiconductor interconnect and packaging. For more
information, please call 408-321-6000 or visit www.xperi.com.
DTS, Xperi and their respective logos are trademarks or registered
trademarks of affiliated companies of Xperi Corporation in the United
States and other countries. All other company, brand and product names
may be trademarks or registered trademarks of their respective companies.
Xperi Safe Harbor Statement
This press release contains forward-looking statements, which are made
pursuant to the safe harbor provisions of the Private Securities
Litigation Reform Act of 1995. Forward-looking statements involve risks
and uncertainties that could cause actual results to differ
significantly from those projected, particularly with respect to the
features, benefits, characteristics and availability of Invensas' Direct
Bond Interconnect technology. Material factors that may cause results to
differ from the statements made include the plans or operations relating
to the businesses of Xperi; market or industry conditions; changes in
patent laws, regulation or enforcement, or other factors that might
affect Xperi's ability to protect or realize the value of its
intellectual property; the expiration of license agreements and the
cessation of related royalty income; the failure, inability or refusal
of licensees to pay royalties; initiation, delays, setbacks or losses
relating to Xperi's intellectual property or intellectual property
litigations, or invalidation or limitation of key patents; fluctuations
in operating results due to the timing of new license agreements and
royalties, or due to legal costs; the risk of a decline in demand for
semiconductors and products utilizing our audio and imaging
technologies; failure by the industry to use technologies covered by
Xperi's patents; the expiration of Xperi's patents; Xperi's ability to
successfully complete and integrate acquisitions of businesses; the risk
of loss of, or decreases in production orders from, customers of
acquired businesses; financial and regulatory risks associated with the
international nature of 's businesses; failure of Xperi's products to
achieve technological feasibility or profitability; failure to
successfully commercialize Xperi's products; changes in demand for the
products of Xperi's customers; limited opportunities to license
technologies due to high concentration in applicable markets for such
technologies; the impact of competing technologies on the demand for
Xperi's technologies; failure to realize the anticipated benefits of
Xperi's recent acquisition of DTS, Inc., including as a result of
integrating the business of DTS; pricing trends, including Xperi's
ability to achieve economies of scale; the expected amount and timing of
cost savings and operating synergies; and other developments in the
markets in which Xperi operates, as well as management's response to any
of the aforementioned factors. You are cautioned not to place undue
reliance on the forward-looking statements, which speak only as of the
date of this release.
The foregoing review of important factors should not be construed as
exhaustive and should be read in conjunction with the other cautionary
statements that are included herein and elsewhere, including the Risk
Factors included in Xperi's recent reports on Form 10-K and Form 10-Q
and other documents of Xperi on file with the Securities and Exchange
Commission (the "SEC"). Xperi'sSEC filings are available publicly on
the SEC's website at www.sec.gov.
Any forward-looking statements made or incorporated by reference herein
are qualified in their entirety by these cautionary statements, and
there can be no assurance that the actual results or developments
anticipated by Xperi will be realized or, even if substantially
realized, that they will have the expected consequences to, or effects
on, Xperi or its business or operations. Except to the extent required
by applicable law, Xperi undertakes no obligation to update publicly or
revise any forward-looking statement, whether as a result of new
information, future developments or otherwise.
About SMIC
Semiconductor Manufacturing International Corporation ("SMIC"; NYSE:
SMI; SEHK: 981) is one of the leading semiconductor foundries in the
world and the largest and most advanced foundry in mainland China. SMIC
provides integrated circuit (IC) foundry and technology services on
process nodes from 0.35 micron to 28 nanometer. Headquartered in
Shanghai, China, SMIC has an international manufacturing and service
base. In China, SMIC has a 300mm wafer fabrication facility (fab) and a
200mm fab in Shanghai; a 300mm fab and a majority-owned 300mm fab for
advanced nodes in Beijing; 200mm fabs in Tianjin and Shenzhen; and a
majority-owned joint-venture 300mm bumping facility in Jiangyin;
additionally, in Italy SMIC has a majority-owned 200mm fab. SMIC also
has marketing and customer service offices in the U.S., Europe, Japan,
and Taiwan, and a representative office in Hong Kong.
For more information, please visit www.smics.com.
SMIC Safe Harbor Statement
(Under the Private Securities Litigation Reform Act of 1995)
This press release contains, in addition to historical information,
"forward-looking statements" within the meaning of the "safe harbor"
provisions of the U.S. Private Securities Litigation Reform Act of 1995.
These forward-looking statements are based on SMIC's current
assumptions, expectations and projections about future events. SMIC uses
words like "believe," "anticipate," "intend," "estimate," "expect,"
"project," "target" and similar expressions to identify forward looking
statements, although not all forward-looking statements contain these
words. These forward-looking statements are necessarily estimates
reflecting the best judgment of SMIC's senior management and involve
significant risks, both known and unknown, uncertainties and other
factors that may cause SMIC's actual performance, financial condition or
results of operations to be materially different from those suggested by
the forward-looking statements including, among others, risks associated
with cyclicality and market conditions in the semiconductor industry,
intense competition in the semiconductor industry, SMIC's reliance on a
small number of customers, timely wafer acceptance by SMIC's customers,
timely introduction of new technologies, SMIC's ability to ramp new
products into volume, supply and demand for semiconductor foundry
services, industry overcapacity, shortages in equipment, components and
raw materials, availability of manufacturing capacity, financial
stability in end markets, orders or judgments from pending litigation,
intensive intellectual property litigation in semiconductor industry,
general economic conditions and fluctuations in currency exchange rates.
In addition to the information contained in this press release, you
should also consider the information contained in our other filings with
the SEC, including our annual report on Form 20-F filed with the SEC on
April 27, 2017, especially in the "Risk Factors" section and such other
documents that we may file with the SEC or The Hong Kong Stock Exchange
Limited ("SEHK") from time to time, including current reports on Form
6-K. Other unknown or unpredictable factors also could have material
adverse effects on our future results, performance or achievements. In
light of these risks, uncertainties, assumptions and factors, the
forward-looking events discussed in this press release may not occur.
You are cautioned not to place undue reliance on these forward-looking
statements, which speak only as of the date stated or, if no date is
stated, as of the date of this press release. Except as may be required
by law, SMIC undertakes no obligation and does not intend to update any
forward-looking statement, whether as a result of new information,
future events or otherwise.
SOURCE: XPERI CORPORATION
XPER-I
View source version on businesswire.com: http://www.businesswire.com/news/home/20171108005383/en/
SMIC Media Contact
Terry Ding
+86-21-3861-0000 x16812
Terry_Ding@smics.com
or
Xperi
PR Agency Contact:
The Brand Amp
Nicole Fait, +1
949-438-1104
nicolef@thebrandamp.com
or
Xperi
PR Contact:
Jordan Miller, +1 818-436-1082
jordan.miller@xperi.com
or
Xperi
Investor Relations Contact:
Geri Weinfeld, +1 818-436-1231
geri.weinfeld@xperi.com
Source: Xperi Corporation
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