Additionally, Invensas Named "Fabless of the Year," and its DBI
Technology Captures "Process of the Year" Award at Industry Awards
Reception
SAN FRANCISCO--(BUSINESS WIRE)--
Xperi
Corporation (Nasdaq:XPER), ("Xperi" or the "Company") is proud to
announce its wholly owned subsidiary, Invensas,
the world's leading provider of advanced semiconductor packaging and 3D
interconnect technologies, captured three 3D InCites Awards honors,
revealed at a reception last night. Dr. Paul Enquist, vice president of
3D R&D, received the prestigious Lifetime Achievement Award for his
numerous innovations and contributions to the semiconductor industry,
Invensas was honored as Fabless of the Year, and its Direct Bonding
Interconnect (DBI®) technology won Process of the Year. The
3D InCites Awards were established in 2013 to acknowledge companies and
individuals who were instrumental in the development and
commercialization of semiconductor 3D integration technologies. The
awards were determined by an online voting process amongst industry
professionals.
This Smart News Release features multimedia. View the full release here:
http://www.businesswire.com/news/home/20170713005315/en/
Dr. Paul Enquist, vice president of 3D R&D at Invensas, a subsidiary of Xperi Corp., captured the 2017 3D InCites Lifetime Achievement Award. (Photo: Business Wire)
2017 3D InCites Lifetime Achievement Award - Dr. Paul Enquist
For more than 30 years, Dr. Enquist has been a pioneer in developing
cutting-edge semiconductor technologies. As a co-founder of Ziptronix,
acquired by the Company in 2015, Dr. Enquist is the key inventor of
ZiBond® and DBI low temperature bonding and 3D integration
technologies, which were integrated with Invensas' portfolio of
packaging and interconnect solutions. These technologies have been
commercially adopted in more than one billion semiconductor devices
across a wide range of mobile, consumer, industrial and automotive
products.
"Dr. Enquist's 3D InCites Lifetime Achievement Award is extremely well
deserved," said Craig Mitchell, president of Invensas. "His innovations
have resulted in foundational 3D semiconductor technologies that allow
the industry to scale beyond the limitations of Moore's Law. We are also
very proud of the 3D InCites Fabless of the Year and Process of the Year
honors we have received."
ZiBond is a low temperature homogeneous (oxide to oxide) direct bonding
technology that forms strong bonds between wafers or die with same or
different coefficients of thermal expansion. DBI is a low temperature
hybrid direct bonding technology that allows wafers, or die, to be
bonded with exceptionally fine-pitch 3D electrical interconnect. These
platform technologies are applicable to a wide range of semiconductor
devices including Image Sensors, MEMS, RF Front Ends, and Memory.
About Xperi Corporation
Xperi Corporation (Nasdaq:XPER) and its wholly owned subsidiaries, DTS,
FotoNation, Invensas and Tessera, are dedicated to creating innovative
technology solutions that enable extraordinary experiences for people
around the world. Xperi's solutions are licensed by hundreds of leading
global partners and have shipped in billions of products in areas
including premium audio, broadcast, computational imaging, computer
vision, mobile computing and communications, memory, data storage,
and 3D semiconductor interconnect and packaging. For more information,
please call +1 408-321-6000 or visit www.xperi.com.
Invensas, Xperi and their respective logos are trademarks or
registered trademarks of affiliated companies of Xperi Corporation in
the United States and other countries. All other company, brand and
product names may be trademarks or registered trademarks of their
respective companies.
SOURCE: XPERI CORPORATION
XPER-I
View source version on businesswire.com: http://www.businesswire.com/news/home/20170713005315/en/
PR Contact:
Xperi Corporation
Jordan Miller, +1
818-436-1082
jordan.miller@xperi.com
or
Investor
Relations Contact:
Xperi Corporation
Geri Weinfeld, +1
818-436-1231
geri.weinfeld@xperi.com
Source: Xperi Corporation
News Provided by Acquire Media