Leading Semiconductor Foundry to Leverage Revolutionary Wafer Bonding
And 3D Interconnect Technology for Advanced Image Sensor Solutions
SHANGHAI & SAN JOSE, Calif.--(BUSINESS WIRE)--
Semiconductor
Manufacturing International Corporation (NYSE:SMI; SEHK: 981)
("SMIC"), one of the leading semiconductor foundries in the world and
the largest and most advanced foundry in mainland China, has executed a
technology transfer and license agreement for Invensas'
Direct Bond Interconnect (DBI®) technology. Through this
agreement, SMIC will be able to offer this bonding technology for use by
image sensor manufacturing customers. Invensas is a wholly owned
subsidiary of Xperi
Corporation (Nasdaq:XPER) ("Xperi").
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"As one of the leading foundries, SMIC delivers advanced semiconductor
manufacturing processes to device makers around the world, and we are
pleased to integrate DBI technology into our capabilities," said Dr.
Tzu-Yin Chiu, Chief Executive Officer and Executive Director of SMIC.
"This technology is a key enabler for the fabrication of 3D stacked
image sensors, and by working closely with Invensas, we will accelerate
the development and commercialization of a new generation of imaging
products for our customers."
DBI technology is a low temperature hybrid wafer bonding solution that
allows wafers to be bonded with exceptionally fine pitch 3D electrical
interconnect without requiring bond pressure. DBI 3D interconnect can
eliminate the need for thru silicon vias (TSVs) reducing die size and
cost while providing a roadmap to pixel level interconnect for future
generations of image sensors.
"We are thrilled to enter into this licensing agreement with SMIC, one
of the largest and most respected semiconductor foundries in the world,"
said Craig Mitchell, president of Invensas. "SMIC recognizes the
significant benefits of DBI technology for customers worldwide. We look
forward to working closely with SMIC to integrate this enabling platform
into their world-class design and manufacturing environment."
About SMIC
Semiconductor Manufacturing International Corporation ("SMIC"; NYSE:
SMI; SEHK: 981) is one of the leading semiconductor foundries in the
world and the largest and most advanced foundry in mainland China. SMIC
provides integrated circuit (IC) foundry and technology services on
process nodes from 0.35 micron to 28 nanometer. Headquartered in
Shanghai, China, SMIC has an international manufacturing and service
base. In China, SMIC has a 300mm wafer fabrication facility (fab) and a
200mm fab in Shanghai; a 300mm fab and a majority-owned 300mm fab for
advanced nodes in Beijing; 200mm fabs in Tianjin and Shenzhen; and a
majority-owned joint-venture 300mm bumping facility in Jiangyin;
additionally, in Italy SMIC has a majority-owned 200mm fab. SMIC also
has marketing and customer service offices in the U.S., Europe, Japan,
and Taiwan, and a representative office in Hong Kong. For more
information, please visit www.smics.com.
Safe Harbor Statements
(Under the Private Securities Litigation Reform Act of 1995)
This document contains, in addition to historical information,
"forward-looking statements" within the meaning of the "safe harbor"
provisions of the U.S. Private Securities Litigation Reform Act of 1995.
These forward-looking statements are based on SMIC's current
assumptions, expectations and projections about future events. SMIC uses
words like "believe," "anticipate," "intend," "estimate," "expect,"
"project" and similar expressions to identify forward looking
statements, although not all forward-looking statements contain these
words. These forward-looking statements are necessarily estimates
reflecting the best judgment of SMIC's senior management and involve
significant risks, both known and unknown, uncertainties and other
factors that may cause SMIC's actual performance, financial condition or
results of operations to be materially different from those suggested by
the forward-looking statements including, among others, risks associated
with cyclicality and market conditions in the semiconductor industry,
intense competition, timely wafer acceptance by SMIC's customers, timely
introduction of new technologies, SMIC's ability to ramp new products
into volume, supply and demand for semiconductor foundry services,
industry overcapacity, shortages in equipment, components and raw
materials, availability of manufacturing capacity, financial stability
in end markets and intensive intellectual property litigation in high
tech industry.
In addition to the information contained in this document, you should
also consider the information contained in our other filings with the
SEC, including our annual report on Form 20-F filed with the SEC on
April 25, 2016, especially in the "Risk Factors" section and such other
documents that we may file with the SEC or SEHK from time to time,
including on Form 6-K. Other unknown or unpredictable factors also could
have material adverse effects on our future results, performance or
achievements. In light of these risks, uncertainties, assumptions and
factors, the forward-looking events discussed in this document may not
occur. You are cautioned not to place undue reliance on these
forward-looking statements, which speak only as of the date stated or,
if no date is stated, as of the date of this document.
About Xperi Corporation
Xperi Corporation (Nasdaq: XPER) and its wholly owned subsidiaries, DTS,
FotoNation, Invensas and Tessera, are dedicated to creating innovative
technology solutions that enable extraordinary experiences for people
around the world. Xperi's solutions are licensed by hundreds of leading
global partners and have shipped in billions of products in areas
including premium audio, broadcast, computational imaging, computer
vision, mobile computing and communications, memory, data storage,
and 3D semiconductor interconnect and packaging. For more information,
please visit www.xperi.com.
For more information on Invensas' DBI technology and other advanced
semiconductor packaging and interconnect solutions from Invensas, please
visit www.invensas.com.
Xperi, Invensas and their respective logos are trademarks or
registered trademarks of Xperi Corporation in the United States and
other countries. All other company, brand and product names may be
trademarks or registered trademarks of their respective companies.
Safe Harbor Statement
This press release contains forward-looking statements, which are made
pursuant to the safe harbor provisions of the Private Securities
Litigation Reform Act of 1995. Forward-looking statements involve risks
and uncertainties that could cause actual results to differ
significantly from those projected, particularly with respect the DBI
technology transfer and license agreement. Material factors that may
cause results to differ from the statements made include the plans or
operations relating to the businesses of Xperi; market or industry
conditions; changes in patent laws, regulation or enforcement, or other
factors that might affect Xperi's ability to protect or realize the
value of its intellectual property; the expiration of license agreements
and the cessation of related royalty income; the failure, inability or
refusal of licensees to pay royalties; initiation, delays, setbacks or
losses relating to Xperi's intellectual property or intellectual
property litigations, or invalidation or limitation of key patents;
fluctuations in operating results due to the timing of new license
agreements and royalties, or due to legal costs; the risk of a decline
in demand for semiconductors and products utilizing our audio and
imaging technologies; failure by the industry to use technologies
covered by Xperi's patents; the expiration of Xperi's patents; Xperi's
ability to successfully complete and integrate acquisitions of
businesses; the risk of loss of, or decreases in production orders from,
customers of acquired businesses; financial and regulatory risks
associated with the international nature of Xperi's businesses; failure
of Xperi's products to achieve technological feasibility or
profitability; failure to successfully commercialize Xperi's products;
changes in demand for the products of Xperi's customers; limited
opportunities to license technologies due to high concentration in
applicable markets for such technologies; the impact of competing
technologies on the demand for Xperi's technologies; failure to realize
the anticipated benefits of Xperi's recent acquisition of DTS, Inc.,
including as a result of integrating the business of DTS; pricing
trends, including Xperi's ability to achieve economies of scale; the
expected amount and timing of cost savings and operating synergies; and
other developments in the markets that Xperi operates, as well as
management's response to any of the aforementioned factors. You are
cautioned not to place undue reliance on the forward-looking statements,
which speak only as of the date of this release.
The foregoing review of important factors should not be construed as
exhaustive and should be read in conjunction with the other cautionary
statements that are included herein and elsewhere, including the Risk
Factors included in Xperi's recent reports on Form 10-K and Form 10-Q
and other documents of Xperi on file with the Securities and Exchange
Commission (the "SEC"). Xperi's SEC filings are available publicly on
the SEC's website at www.sec.gov.
Any forward-looking statements made or incorporated by reference herein
are qualified in their entirety by these cautionary statements, and
there can be no assurance that the actual results or developments
anticipated by Xperi will be realized or, even if substantially
realized, that they will have the expected consequences to, or effects
on, Xperi or its business or operations. Except to the extent required
by applicable law, Xperi undertakes no obligation to update publicly or
revise any forward-looking statement, whether as a result of new
information, future developments or otherwise.
SOURCE: XPERI CORPORATION
XPER-I
View source version on businesswire.com: http://www.businesswire.com/news/home/20170314006197/en/
Xperi PR Agency Contact:
Zeno Group
Dan Sorensen, +1
650-801-0944
dan.sorensen@zenogroup.com
or
SMIC
PR Contact
Terry Ding, +86-21-3861-0000 x16812
Terry_Ding@smics.com
Source: Xperi Corporation
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