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Xperi Announces DBI® Ultra Die-to-Wafer Hybrid Bonding Technology for High Performance Computing

May 22, 2019

Low Profile High Bandwidth Memory (HBM) stacks of 12 and 16 die are now possible

SAN JOSE, Calif.--(BUSINESS WIRE)-- Xperi Corporation (Nasdaq: XPER) is proud to announce Invensas DBI Ultra, a revolutionary, patented die-to-wafer hybrid bonding, 3D interconnect technology platform ushering in a new era of homogeneous and heterogeneous 3D integration unachievable before today. Among a wide range of applications, DBI Ultra makes it possible to manufacture 12- and 16-high HBM stacks while meeting the demanding packaging height and performance requirements for next generation, high-performance computing.

DBI Ultra is an enabling low-temperature, low profile die-to-wafer and die-to-die hybrid bonding technology platform. By eliminating the need for copper pillars and underfill, DBI Ultra can enable a dramatically thinner stack than conventional approaches. DBI Ultra also allows the stacking of known good die that are the same or different sizes, processed on fine or coarse wafer process technology nodes, or manufactured on the same or different wafer sizes while readily scaling down to 1 um interconnect pitch.

DBI Ultra will be showcased at the Xperi booth at ECTC 2019 Exhibits in the Cosmopolitan Hotel, Las Vegas, NV on May 29 and 30.

“We are thrilled to introduce DBI Ultra, the ultimate 3D interconnect and integration solution,” said Craig Mitchell, President of Invensas, a wholly owned subsidiary of Xperi Corporation. “This production-worthy die-to-wafer hybrid bonding platform allows the semiconductor industry to extend beyond Moore's Law, providing unprecedented 2.5D and 3D integration flexibility required for next generation electronics.”

DBI wafer-to-wafer hybrid bonding, the predecessor to DBI Ultra, is already successfully incorporated into image sensors shipping in hundreds of millions of smartphones around the world. DBI Ultra is poised to realize similar success in 3D stacked memory, such as 3DS DRAM and High Bandwidth Memory, as well as in 2.5D and 3D applications requiring the integration of memory with CPUs, GPUs, FPGAs, or SoCs.

For more information about Xperi and its technologies platforms, please visit www.xperi.com.

About Xperi Corporation

Xperi Corporation (Nasdaq: XPER) and its brands, DTS, FotoNation, HD Radio, Invensas and Tessera, are dedicated to creating innovative technology solutions that enable extraordinary experiences for people around the world. Xperi’s solutions are licensed by hundreds of leading global partners and have shipped in billions of products in areas including premium audio, automotive, broadcast, computational imaging, computer vision, mobile computing and communications, memory, data storage, and 3D semiconductor interconnect and packaging. For more information, please call 408-321-6000 or visit www.xperi.com.

DTS, FotoNation, HD Radio, Invensas, Xperi and their respective logos are trademarks or registered trademarks of affiliated companies of Xperi Corporation in the United States and other countries. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.

SOURCE: XPERI CORPORATION
XPER-I

PR Agency Contact:
Nicole Fait, The Brand Amp
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nicolef@thebrandamp.com

Xperi Investor Relations Contact:
Geri Weinfeld
+1 818-436-1231
geri.weinfeld@xperi.com

Source: Xperi Corporation

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